Original document(6 pages)  中文版
    The preent invention relates to a method for enclosing unenclosed integrated circuit in circuit board, including the following steps: firstly an unenclosed intgrated circuit and a circuit board whose size is suitable to be processed by lead bonding device are provided, and then the unenclosed integrated circuit is bonded to the circuit board whose size is suitable to be processed by lead bonding device by attaching leads; second, the described lead bonding operation of said circuit board is completed, and then the surface of said unenclosed integrated circuit is coated with a colloidl protective layer, and finally the above-mentioned circuit board whose leads are bonded is welded to a main circuit board whose area is larger.
Application Number
申请号		 94103917 Application Date
申请日		 1994.04.01
Title 名称 Method for packaging unpackaged integrate circuit into circuit board
Publication Number
公开号		 1109674 Publication Date
公开日		 1995.10.04
Approval Pub. Date Granted Pub. Date
International Classification 分类号 H05K3/30
Applicant(s) Name
申请人		 Yaquan Co., Ltd.
Address 地址
Inventor(s) Name 发明人
Attorney & Agent 代理人 YANG GUOXU

  
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