Original document(8 pages) Authorized document(8 pages) 中文版
    An application of pressure-sensitive adhesive in stripping the excessive indium layer during preparing the indium beads of focal plane device is disclosed. Said adhesive is an acrylate-type synthetic organic high-molecular one. Its advantage is that a high-density and -uniformity array of controllable indium beads can be prepared by ordinary IC preparing technology.
Application Number
申请号		 02157697 Application Date
申请日		 2002.12.24
Title 名称 Use of pressure sensitive adhesive in removing surplus indium layer in preparation of indium beads for focal plane device
Publication Number
公开号		 1424766 Publication Date
公开日		 2003.06.18
Approval Pub. Date 2006.07.12 Granted Pub. Date 2006.07.12
International Classification 分类号 H01L27/14,C09J123/08,H01L21/00
Applicant(s) Name
申请人		 Shanghai Technical Physics Inst., Chinese Academy of Sciences
Address 地址 200083
Inventor(s) Name 发明人 Zhu Jianmei, Chen Boliang
Attorney & Agent 代理人 zhang zechun

  
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