Original document(26 pages)  中文版
    A depth turn �C off method of memory wafer includes switching off voltage regulator and charge pumping circuit, making suspension joint on memory unit voltage and using voltage obtained by external water voltage to replace internal power supply voltage of supporting circuit i.e. entering all memory units to precharge state before depth turn �C off mode is entered and making memory unit be suspension �C joint after depth turn �C off mode is entered to use depth turn �C off signal to control circuit of connecting voltage obtained by external wafer to supporting circuit.
Application Number
申请号
200410095632 Application Date
申请日
2004.11.26
Title 名称 Memory chip internal power administrative framework in deep shutdown mode
Publication Number
公开号
1779852 Publication Date
公开日
2006.05.31
Approval Pub. Date Granted Pub. Date
International Classification 分类号 G11C11/401,G11C11/41,G11C7/00
Applicant(s) Name
申请人
Yuchuang Science and Technology Co., Ltd.
Address 地址
Inventor(s) Name 发明人 Ding Dagang, Wang Minghong, Xu Renshou
Attorney & Agent 代理人 wu linsong

  
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